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Shanghai Bolooming Technology Joins PACKCON 2026: Exploring the Future of Packaging Innovation in Shenzhen
Shanghai Bolooming Technology Joins PACKCON 2026: Exploring the Future of Packaging Innovation in Shenzhen
Apr 15, 2026

Shenzhen, China – April 15–17, 2026 – Shanghai Bolooming is among the many industry players participating in the 2026 China Container Packaging Exhibition (PACKCON 2026), a flagship event under the WEPACK World Expo of Packaging Ind...

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